Qualcomm’s new 5-nanometer X60 modem chip will power next-gen 5G phones

Qualcomm Inc. has a new 5G modem chip for smartphones that’s the first in the industry to feature a more efficient five-nanometer architecture and promises up to double the connection speeds in some cases.
 
Dubbed the X60, the modem was unveiled this morning. The fact that Qualcomm is using a five-nanometer process means the chip will be less power-hungry than the previous generation X55 model.
 
Moreover, thanks to an improved antenna module dubbed the QTM535, it will be smaller as well. The X60 will reportedly be manufactured at least in part by Samsung Electronics Co. Ltd.’s semiconductor division.
 
Beyond being more efficient, the modem is intended to enable faster connections. Qualcomm is promising a maximum download speed of 7.5 gigabits per second on 5G networks versus the 7-gigabit-per-second speed made possible by the X55.
 
These kinds of data transfer rates will only be available from carriers that implement so-called millimeter-wave technology in their wireless infrastructure. The term refers to a specific range of frequencies that 5G devices use to transmit data. A second section of the radio spectrum, known as the sub-6Ghz band, is also employed in 5G networks and provides slower connections but works better when the cell tower is far away from the user.
 
Qualcomm has equipped the X60 with a feature that will enable it to combine millimeter-wave signals with sub-6Ghz signals to enhance connectivity. That capability is one of the main contributors to the modem’s increased maximum download speed of 7.5 gigabits per second. Average download rates will be better than with the X55 as well, according to Qualcomm, though it didn’t specify by how much.
 
For connections that use the only the sub-6Ghz band, meanwhile, the chip provider is promising double the peak speeds on the high end.
 
The X60 will start sampling to smartphone makers this quarter and is expected to ship with devices in early 2021. The product represents a notable milestone not just for Qualcomm but also the entire mobile industry, since the company is the dominant maker of modem chips for smartphones. If the current handset landscape is any indication, most of the 5G-compatible devices that will debut this year and next will feature Qualcomm silicon under the hood.
 
“As 5G standalone networks are introduced in 2020, our third-generation 5G modem-RF platform brings extensive spectrum aggregation capabilities and options to fuel the rapid expansion of 5G rollouts while enhancing coverage, power efficiency and performance for mobile devices,” Qualcomm President Cristiano Amon said in a statement.

---