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ICT

Date:18/07/12

NXP's new audio chip pumps up the volume for mobile device speakers

Dutch company NXP -- best known for it's NFC solutions -- introduced a new audio chip today that's set to significantly improve the sound quality of the micro-speakers commonly built into mobile devices such as smartphones and tablets.

The TFA9887 integrated circuit combines NXP's CoolFlux audio DSP, a class-D amplifier with current sensing and a DC-to-DC converter to boost the output level of micro-speakers up to five times (up to 2.6W RMS) without damaging the driver. Class-D amplifiers are highly efficient and, when combined with a DC-to-DC converter, provide a strong and clear signal regardless of battery level.

With current sensing, the chip uses feedback from the driver to optimize power delivery, allowing micro speakers to provide louder, richer sound with deeper, tighter bass over the entire lifetime of a mobile device. Are you ready to turn it up to 11? Check out the full PR after the break.




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